2025 (Current Year) Faculty Courses School of Engineering Undergraduate major in Electrical and Electronic Engineering

Integrated Circuit Technology

Academic unit or major: Undergraduate major in Electrical and Electronic Engineering
Instructor(s): Hitoshi Wakabayashi
Class Format: Lecture (Face-to-face)
Media-enhanced courses: -
Day of week/Period (Classrooms): 7-8 Mon (S2-204(S221)) / 7-8 Thu (S2-204(S221))
Class: -
Course Code: EEE.C341
Number of credits: 200
Course offered: 2025
Offered quarter: 4Q
Syllabus updated: Jun 24, 2025
Language: Japanese

Syllabus

Course overview and goals

In electrical/electronic engineering and information/communication engineering, it is important to understand the integrated circuit technology to support the current electronics industry. Specific topics of lectures relate to CMOS integrated circuits, structures, manufacturing methods, design technology, testing technology, reliability, packaging technology, the signal transmission, the memory circuit, and interface circuits will be discussed to comprehensively understand.

Course description and aims

[Target] To understand the CMOS integrated circuits to support the current electronics industry. In addition, we aim to be able to apply to the actual integrated circuit design.
[Theme] In this lecture on CMOS integrated circuit, their structures, production method, design technology, test technology, reliability, packaging technology, signal transmission, a memory circuit, interface circuit will be discussed to comprehensively understand for the foundamentals on the electrical/electronic engineering and information communication engineering.

Student learning outcomes

実務経験と講義内容との関連 (又は実践的教育内容)

In this lecture, a teaching faculty member with 20 years of practical experiences used to be belonging to multiple companies in the field of device technologies for integrated circuits will provide valuable contents on basics and applications in integrated circuit engineering, based on his practical experiences.

Keywords

CMOS integrated circuit, their structures, production method, design technology, test technology, reliability, packaging technology, signal transmission, a memory circuit, interface circuits

Competencies

Specialist skills
Intercultural skills
Communication skills
Critical thinking skills
Practical and/or problem-solving skills
・Applied specialist skills on EEE

Class flow

Lecture and exercise

Course schedule/Objectives

	Course schedule	Objectives
Class 1	Introduction on integrated circuits and their design and menufacturing flow	Introduction about various functionalities in the smartphone and their manufacturing technology
Class 2	Basic process technologies in integrated circuit manufacturing	Silicon wafer, lighography, film deposition, etching, wet cleaning, chemical-mechanical polishing and so on
Class 3	MOSFET and scaling law	Operating principle of the MOSFET and its scaling law
Class 4	Electrical characteristics of CMOS logic circuits	Understanding of the operation of CMOS inverter
Class 5	CMOS logic circuits	The understanding of CMOS logic circuits, such as NAND, NOR and so on
Class 6	Electrical properties of the wiring	Understanding on aluminum wiring, copper interconnect, a low dielectric constant film, air gap, repeater, H tree, the average wire length, and so on
Class 7	Logic circuit design	The understanding of the logic circuit design techniques such as SPICE, RTL, HDL, C language design, and so on
Class 8	Memory circuits	Latch circuit, SRAM, DRAM, Flash memory, PCM, RRAM, MRAM, STT-MRAM, FeRAM
Class 9	Layout design	The understanding of the mask layout design techniques through exercises
Class 10	Test, yield and reliability	The understanding of TEG, function test, reliability acceleration test, failure model, yield, cost and so on
Class 11	High-speed and low-power consumption technologies	The understanding of drivability enhancement, voltage reduction, parasitic resistance and capacity reductions, power-gating, PLL technology and so on
Class 12	Interface circuit technology	The understanding of amplifier, A/D conversion, D/A conversion, the differential transmission, radio transmission, and so on
Class 13	Packaging technology and future prospects of the integrated circuits	Understanding of assembling technology and the future prospects of integrated circuits
Class 14	Confirmation of the understanding of all contents	Confirmation of the understanding of all contents

Study advice (preparation and review)

To enhance effective learning, students are encouraged to spend approximately 100 minutes preparing for class and another 100 minutes reviewing class content afterwards (including assignments) for each class.
They should do so by referring to textbooks and other course material.

Textbook(s)

Print out uploaded data on the LMS by yourself.

Reference books, course materials, etc.

Neil H. E. West and David Harris, “CMOS VLSI Design: A Circuits and Systems Perspective,” Fourth Edition, Addison Wesley.
Jan M. Rabaey, Anantha Chanfrakasan and Borivoje Nikolic, “Digital Integrated Circuits: A Design Perspective,” Second Edition, Printice Hall.

Evaluation methods and criteria

Evaluated by final exam and exercise with 80% and 20%, respectively

Related courses

EEE.C202 ： Electric Circuits II
EEE.C211 ： Analog Electronic Circuits
EEE.C321 ： Digital Electronic Circuits
EEE.D351 ： Electron Devices I
EEE.D352 ： Electron Devices II
EEE.D371 ： Memory Devices
EEE.D391 ： Semiconductor Fabirication Process
EEE.C201 ： Electric Circuits I
SCE.E201 ： Basic Theory of Electric Circuit

Prerequisites

None

Contact information (e-mail and phone) Notice : Please replace from ”[at]” to ”@”(half-width character).

Hitoshi Wakabayashi (wakabayashi.h.b3e4[at]m.isct.ac.jp)

Office hours

9:00-17:30