2023 Faculty Courses School of Engineering Department of Electrical and Electronic Engineering Graduate major in Electrical and Electronic Engineering
Advanced Topics on Material Analysis and Basics of Plasma Processing for Nano Devices
- Academic unit or major
- Graduate major in Electrical and Electronic Engineering
- Instructor(s)
- Shigetaka Tomiya / Tetuya Tatsumi / Toshio Nishi / Hitoshi Wakabayashi
- Class Format
- Lecture (Face-to-face)
- Media-enhanced courses
- -
- Day of week/Period
(Classrooms) - 1-2 Mon (G2-202 (G221)) / 1-2 Thu (G2-202 (G221))
- Class
- -
- Course Code
- EEE.D592
- Number of credits
- 200
- Course offered
- 2023
- Offered quarter
- 2Q
- Syllabus updated
- Jul 8, 2025
- Language
- English
Syllabus
Course overview and goals
Future semiconductor devices are required to realize high-performance without variation by realizing nanometer-order fine pattern fabrication and technologies for controlling defects and interfaces at the atomic level. In this course, leading-edge researchers from industries will give lectures on topics from basics and advanced one about materials analysis technology and plasma processing/surface treatment technology, which are applied to from R&D to manufacturing site in the industry.
Course description and aims
Through this course, you will deepen the basic understanding of cutting-edge technology used in manufacturing industries (especially material analysis and plasma processing technology) that will be required in real society. You will also understand need-to-prepare to work as a researcher and engineer in the industry and the atmosphere there.
Student learning outcomes
実務経験と講義内容との関連 (又は実践的教育内容)
In this lecture, teaching faculty members with 30 years of practical experiences belonging to the company, now, in the field of material and process technologies for electron devices will provide valuable contents on basics and applications in materials and plasma process, based on their practical experiences.
Keywords
Semiconductor, LSI, device, process, miniaturization, plasma, dry etching, microfabrication, crystal defect, structural analysis, surface analysis, optical properties, device reliability technology, physical property simulation, material informatics
Competencies
- Specialist skills
- Intercultural skills
- Communication skills
- Critical thinking skills
- Practical and/or problem-solving skills
Class flow
Lecture
Course schedule/Objectives
| Course schedule | Objectives | |
|---|---|---|
| Class 1 | Analysis-1: Defects in Semiconductors and their characterization techniques | To understand the basic properties of semiconductor nano materials and devices, and the purpose of characterization. |
| Class 2 | Analysis: Structural Characterization (1) | Explain the principle and basics of X-ray-based characterization |
| Class 3 | Analysis: Surface Analysis | Explain the principles and basics of scanning probe microscopy, secondary ion mass spectrometry, and photoelectron spectroscopy |
| Class 4 | Analysis: Structural Characterization (2) | Explain the principles and basics of electron microscopy. Learn about the latest 3D structural analysis. |
| Class 5 | Analysis: Electrical and Optical characterizations | Explain the principles and basics of electrical and optical characterizations |
| Class 6 | Analysis: Reliability issues in Semiconductor Devices | Explain device degradation phenomena and reliability evaluation techniques (mainly for semiconductor light emitting devices) |
| Class 7 | Analysis: Materials Simulation and Materials Informatics | Promote understanding of the latest and future trends in material and device development utilizing informatics. |
| Class 8 | Plasma-1: What is plasma? | Understanding the role of plasma processes in semiconductor device manufacturing |
| Class 9 | Plasma-2: Control of neutral particles | Describes the motion of neutral particles in a plasma system |
| Class 10 | Plasma-3: Control of charged particles | Understand the relationship between the application of electric and magnetic fields and the motion of electrons and ions |
| Class 11 | Plasma-4: Collision | Understanding collision reactions such as ionization and excitation of atoms and molecules |
| Class 12 | Plasma-5: Sheath and ion energy control | Understanding ion acceleration and its control mechanism for a substrate placed in a plasma |
| Class 13 | Plasma-6: Plasma systems | Understand the mechanism of plasma reaction control mechanism |
| Class 14 | Plasma-7: Process control | Understand the current status and examples of plasma technology used in advanced device manufacturing |
Study advice (preparation and review)
The content of this course can be fully understood through lectures and solving simple report assignments. If you have any questions, please ask them on the day and proceed to the next lecture.
Textbook(s)
To distribute the hand-outs during class
Reference books, course materials, etc.
・D.B. Bwillians: “Transmission Electron Microscopy: A Textbook for Materials Science”, Plenum Press (2009)
・S. Tomiya: “Chap. 7”Structural Defects in GaN-based Materials and their relation to GaN-based Laser diodes” in O. Ueda and S. J. Pearton (ed.) “Materials and Reliability Handbook for Semiconductor Optical and Electron Devices” Springer (2014)
・Michael K. Miller ：” Atom Probe Tomography: Analysis at the Atomic Level “, Springer (2000)
・Michael A. Lieberman, “Principles of Plasma Discharges and Materials Processing”, Wiley-Interscience (1994).
Evaluation methods and criteria
To submit the report instead not to conduct the examination.
Related courses
- EEE.C341 Integrated Circuit Technology Integrated Circuit Technology
- EEE.P451 Plasma Engineering
- EEE.D391 Semiconductor Fabrication Process
- EEE.D411 Semiconductor Physics
- EEE.D401 Fundamentals of Electronic Materials
- MAT.M402 Characterization of Nanomaterials b
- EEE.D431 Fundamentals of Light and Matter I
Prerequisites
No specific requirements, however Students who are interested in analysis and process technologies in the industry are highly preferable.
Contact information (e-mail and phone) Notice : Please replace from ”[at]” to ”@”(half-width character).
Hitoshi Wakabayashi (wakabayashi.h.ab[at]m.titech.ac.jp),
Shigetaka Tomiya (tomiya.s.aa[at]m.titech.ac.jp),
Tetsuya Tatsumi (tatsumi.t.ac[at]m.titech.ac.jp)
Toshio Nishi (Toshio.Nishi[at]sony.com)
Office hours
9:00-17:00
Other
This class is held as part of a joint research course by “Corporate DE” of Sony Corporation. We are looking forward to actively attending those who have basic queries on material analysis technology and plasma processing, as well as those who are interested in research and development at companies, and those who are willing to obtain information that will be helpful for future careers. The lectures are basically given in English, but some of the explanations and questions are also given in Japanese, so even people who are not good at English can fully understand them. “DE (Distinguished Engineers)" is a title given to technology professionals, with only 40 people appointed throughout all Sony group companies.